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Horizon's Starry cabin-drive chip won a premium AI cockpit program with Pateo

Horizon Robotics said its partner Pateo had been named platform supplier at an unnamed leading Chinese new energy automaker, in what it called the industry's first high-end AI cockpit award using a fully domestic cabin-drive-integrated chip.

Horizon Robotics said on August 13 that Pateo, a partner in its ecosystem, had won a supplier award from a leading domestic new energy automaker for a new vehicle platform, providing a high-end AI cockpit built on Horizon’s Starry chip.

The company described the award as the industry’s first high-end AI cockpit project to use a fully domestic cabin-drive-integrated chip, and said it marked a further acceleration of Starry into the premium segment. Horizon did not name the automaker.

Horizon launched Starry in April 2026, presenting it as China’s first cabin-drive fusion chip for whole-vehicle intelligence, with iCAR as the global launch partner. The company said the single-chip design broke the hardware barrier between the intelligent driving and intelligent cockpit domains, pooling compute, unifying the system and allowing data to move between functions that previously sat on separate hardware.

The savings Horizon attached to that consolidation are the company’s own figures. It said Starry could reduce in-vehicle hardware space by roughly 50 percent and cut combined hardware cost by 1,500 to 4,000 yuan per vehicle. It also said the development and delivery cycle for vehicle intelligence could fall from 18 months to eight, and that overall delivery time for cabin-drive hardware and software was reduced by 56 percent.

Horizon said Pateo brought a full-stack capability spanning its own operating system and AI application layer, cockpit domain controller hardware, multi-chip adaptation and cloud AI services, and that the two had completed system integration on domestic silicon.

Source: Horizon Robotics, August 13, 2026, in Chinese.

Why it mattersMerging the cockpit and driving domains onto one die removes a hardware boundary that has defined vehicle electronics for a decade, and doing it on domestic silicon at the premium end is where Chinese suppliers have so far been weakest.

Source: Horizon Robotics

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